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Hi, This would be my first time posting on these forums, and I need some help. I've my share of experience with liquid-state torch fired mokume, and am setting up to try my hand at kiln fired solid-state diffusion bonding instead. I've found most of the information I need except one vital detail. I can't seem to find any guidelines on how to select temperature for bonding. Let's start simple here and suppose a sterling silver/copper billet. Sterling melts at 893 C Copper melts at 1083 C Sterling is a hypoeutectoid alloy at 17.5% copper The Eutectic point of silver/copper is at 28.1% copper and around 790 C So here's the question. Do I want to be heating my billet a little under the melting point of sterling, seeing as it is the lowest melting point? Should I be heating a little under the eutectic point? Not sure if the eutectic point is relevant if nothing is hitting liquidus. Perhaps none of the above? Any advice would be greatly appreciated. I can't get my hands on the midget/fergusson books, and most other sources I find all take for granted you've got the basics figured out. Cheers -Pat.